Leader of components with sharing success with customers as its core value!
Our company has four business categories, and each of them can be divided according to product and marketing types.
Produce mobile communication device components (Shield Can, Contact, Deco, Metal Case, Assy, etc)
Produce camera shutter auto focus
Develop and Supply (smart card, USIM, e-passport, e-resident card)
Semiconductor components, computer components, medical equipments, etc
Categories | Products | Description |
---|---|---|
Mobile Communication Device | SHIELD CAN | Blocks electromagnetic waves generated when a mobile communication device is used. Removes noise occurring from the flexible printed circuit board so that it would not be affected by electromagnetic waves from surrounding components and improve wireless sensitivity. Especially, the old type sprays EMI paints to plastic projectiles or dyeing casting cases, but we developed metal Shield Can by using metal plates to make mobile phones lighter and slimmer. Its cost competitiveness is excellent, contributing to lowering the production cost. |
CONTACT | Has features of mobile device' H/W components and earth connection to reinforce antenna frequency sending & receiving features. | |
DECO | Decorates mobile phones' exterior such as Camera Deco, Flash Deco, and Key Deco, and replaces pre-existing expansive products with stainless material product to reduce production cost. | |
ASS'Y Types | Installed and assembled on metal press components on mobile phone exterior projectiles. | |
Metal Case | Metal exterior product that functions as mobile phone frame. Made of aluminum through press, solution heat treatment, and T6 thermal processes. | |
Imaging/Optical Equipment | Shutter | Ultrahigh speed shutter enables corrections for shaking hands. The only method that can solve faulty sensor such as smear and blooming. |
Auto Focus(VCM) | Controls brightness (IRIS) and adjusts focus for short and long distance | |
Software Development | Smart Card | Developed smart card transportation solution, 3G Global GSM Sim, 4G LTE NFC USIM, and EMV Financial IC Solution of VISA and Master |
Other Product | Semiconductors | Heat Sink, metal thermo-diffusion board attached to semiconductors to absorb and discharge heat produced from memory chips. |