- About Sungwoo
- Business Introduction
- Investment Status
- Management Activities
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Leader of components with sharing success with customers as its core value!
Our company produces smart-phone interior components such as Shield Can, exterior components (Deco and Key), and Metal Case. We have manufacturing facilities in Korea, China, and Vietnam, building a global production network. Our branch in Vietnam was established in Jan. 2011 to secure low production cost and competiveness. In 2015, the branch raised its income by 40% year on year to 89.2 billion won, which was its target income.
Despite the glow growth of the smart-phone market in 2016 and a number of internal and external challenges, we will do our best worked to improve manufacturing processes and efficiency by connecting foreign branches, highly focus on survival strategies, and develop new products and secure growth engine.
According to IDC (International Data Corporation), the world's smart-phone sales was 1.3 billion 1.7 million in 2014 and 1.4 billion 40 million in 2015 (10.1% increase from 2014). There are many reasons behind the growth, but the biggest reason is that different kinds of smart-phones emerged from cheap kinds to expensive ones in both existing markets and new markets. In other words, the smart-phone prices have been diversified that people of different economic status can buy them.
The global smart-phone market is already in the mature stage, but sales will continue increasing as new products are released. Smart-phone sales in 2016 is expected to be 1.5 billion, a 5.7% increase year on year. The number will keep growing to 1.9 billion 20 million until 2020. High-spec smart-phone sales will decline, but as overall smart-phones' prices decrease, the shipping amounts will increase gradually. Market research agency 'Gartner' analyzed that the smart-phone market will turn to low-spec smart-phones rather than premium smart-phones. Especially in emerging markets, customers will not change to high-spec smart-phones but to other low-spec ones same as what they used.
Our main semiconductor component, memory module's heat sink, is a metal thermo-diffusion board attached to semiconductors to absorb and discharge heat produced from memory chips semiconductor components. Diffuses heat produced by memory cards with heat sink that covers the entire FBDIMM. As the semiconductor technology is advancing rapidly and the demand for our products went down, we developed new exterior component products (BEZEL DECO and PLATE DECO) to increase our competiveness.